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Modified Epoxy Adhesives – Provide Solutions to Potting Dilemmas

The term modified epoxy is a broad term referring to epoxy adhesives which have been altered to incorporate other properties.

Permabond Modified Epoxies are epoxies that have been formulated to provide increased flexibility, low shrinkage, high peel strength and excellent resistance to harsh environmental conditions.

Combining the properties of conventional epoxies with these added features creates the ideal solution for many potting application dilemmas.

Epoxies are well known for their strength and durability but in certain potting applications the rigidity of the epoxy can impart too much stress onto delicate electrical components potted inside.  Polyurethane potting compounds can shrink and combined with a low adhesion strength to the housing material they easily pull away leaving a leak path between the housing and the cured polyurethane material.

To eliminate these situations, modified epoxies are formulated to shrink less and are flexible to absorb stresses from thermal expansion and contraction. These added features allow for larger areas to be potted and the end result withstands more extreme conditions. Sensitive electronics or delicate PCBs can be easily potted or encapsulated in modified epoxy to protect against weathering, stress, thermal shock and vibration.

Permabond modified epoxies are two component, flowable, room temperature cure materials which can be dispensed from a dual cartridge with static mix nozzles and can be easily incorporated into a high speed production line with automated dispensing equipment.

For further help and advice, please contact Permabond.